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dc.contributor.authorLai, YLen_US
dc.contributor.authorChang, EYen_US
dc.contributor.authorChang, CYen_US
dc.contributor.authorChen, TKen_US
dc.contributor.authorLiu, THen_US
dc.contributor.authorWang, SPen_US
dc.contributor.authorChen, THen_US
dc.contributor.authorLee, CTen_US
dc.date.accessioned2014-12-08T15:02:40Z-
dc.date.available2014-12-08T15:02:40Z-
dc.date.issued1996-05-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.491838en_US
dc.identifier.urihttp://hdl.handle.net/11536/1318-
dc.description.abstractA high-power-density dual-delta-doped AlGaAs/InGaAs/GaAs high electron mobility transistor (HEMT) for personal communication applications has been developed. A 5.0 mm gate-width device operating at a drain bias of 3.0 V gave an output power over 1 W, The 1 mu m gate-length HEMT exhibited a current density of 425 mA/mm at V-gs = 0.5 V, The maximum transconductance of the device was 270 mS/mm, The effective knee voltage was as low as 0.3 V, At the class AB operation, the HEMT demonstrated an output power density of 200 mW/mm, 64% power-added efficiency and 18.2 dB linear gain at 900 MHz, This is the highest power density of a dual-delta-doped AlGaAs/InGaAs/GaAs HEMT reported to date for low voltage (3 V) wireless applications.en_US
dc.language.isoen_USen_US
dc.title5 mm high-power-density dual-delta-doped power HEMT's for 3 V L-band applicationsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.491838en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume17en_US
dc.citation.issue5en_US
dc.citation.spage229en_US
dc.citation.epage231en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
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