完整後設資料紀錄
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dc.contributor.authorHsu, CYen_US
dc.contributor.authorLan, WHen_US
dc.contributor.authorWu, YCSen_US
dc.date.accessioned2014-12-08T15:18:15Z-
dc.date.available2014-12-08T15:18:15Z-
dc.date.issued2005-10-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.44.7424en_US
dc.identifier.urihttp://hdl.handle.net/11536/13194-
dc.description.abstractWe have fabricated GaN-based light-emitting diodes (LEDs) using transparent indium tin oxide (ITO) for p-type contacts. The current-voltage (I-V) characteristics of the devices have been studied. When annealed at 700 degrees C, the p-n junction of the diodes became very leaky, and even electrical short circuits have been observed. According to scanning electron microscopy (SEM) and energy-dispersive X-ray spectrometer analyses (EDS), it was found that indium (In) diffused into the LED structure with defects such as threading dislocations (TDs) or V-pits. The defects provide leakage paths to cause short circuits in p-n junctions at high annealing temperatures.en_US
dc.language.isoen_USen_US
dc.subjectGaNen_US
dc.subjectLEDsen_US
dc.subjectITO contacten_US
dc.subjectleakageen_US
dc.subjectdislocationen_US
dc.titleThermal annealing effect of indium tin oxide contact to GaN light-emitting diodesen_US
dc.typeArticleen_US
dc.identifier.doi10.1143/JJAP.44.7424en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERSen_US
dc.citation.volume44en_US
dc.citation.issue10en_US
dc.citation.spage7424en_US
dc.citation.epage7426en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000232739300044-
dc.citation.woscount9-
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