| Title: | 電鍍奈米雙晶銅-銅接合?究 Cu-To-Cu Direct Bonding Using Electroplated Nanotwinned Cu |
| Authors: | 陳智 國立交通大學材料科學與工程學系（所） |
| Keywords: | ; |
| Issue Date: | 2016 |
| Abstract: | |
| Gov't Doc #: | MOST105-2221-E009-008-MY3 |
| URI: | https://www.grb.gov.tw/search/planDetail?id=11900860&docId=491464 http://hdl.handle.net/11536/131954 |
| Appears in Collections: | Research Plans |
- Copper-to-copper direct bonding using different (111) surface ratios of nanotwinned copper films / Huang, J. W.;Shie, K. C.;Liu, H. C.;Li, Y. J.;Cheng, H. Y.
- 以化學機械研磨之奈米雙晶銅薄膜應用於低溫銅對銅直接接合研究 / 林柏帆;陳智;Lin,Po-Fan
- Low resistance and high reliable Cu-to-Cu joints using highly (111)-oriented nano-twinned copper / Juang, Jing Ye;Shie, Kai Cheng;Li, Yu Jin;Tu, K. N.;Chen, Chih
- Fabrication and characterization of electroplated nanotwinned-copper films on polymer substrates(IMPACT-IAAC 2016) / Chang, Liang-Hsien;Chen, Chih;Hu, Dyi-Chung;Tain, Ray;Chen, Y. H.
- Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure / Wang, I-Ju;Ku, Ching-Shun;Tu-Ngoc Lam;Huang, E-Wen;Tu, K. N.
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