完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Huang, Yen-Jun | en_US |
dc.contributor.author | Hsieh, Yen-Hui | en_US |
dc.contributor.author | Shih, Jian-Yu | en_US |
dc.contributor.author | Chen, Han-Chun | en_US |
dc.contributor.author | Leu, Jihperng | en_US |
dc.contributor.author | Chen, Kuan-Neng | en_US |
dc.date.accessioned | 2017-04-21T06:55:30Z | - |
dc.date.available | 2017-04-21T06:55:30Z | - |
dc.date.issued | 2016-07 | en_US |
dc.identifier.issn | 1533-4880 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1166/jnn.2016.12596 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/132928 | - |
dc.description.abstract | This study examines the metal/polymer interfacial adhesion strength for Cu, Ti and three polymers, BCB, SU-8 and AZ 4620. Detailed discussion and explanation focused on adhesion mechanism between metal and BCB, AZ 4620 dielectric are provided. The adhesion strengths of metal on polymer layer are measured by four point bending (FPB) test, which showed that copper and titanium have different characteristics in metal-polymer adhesion. Additionally, to figure out the interfacial adhesion mechanisms, X-ray photoelectron spectroscopy (XPS) technique is used to investigate the chemical bonding compositions between interfaces. The results indicate that the adhesion strength is enhanced by the intense reaction between metal and oxygen on the polymer main chain at the metal-polymer interfaces. On the other hand, interfacial adhesion strength is weaken owing to the destruction of polymer structure, thus the bonding between metal and polymer-main-chain debonded oxygen are of no effect on adhesion. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | Adhesion | en_US |
dc.subject | Metal | en_US |
dc.subject | Polymer | en_US |
dc.title | Adhesion Property Between Cu, Ti Metal and SU-8, AZ 4620 Polymer Dielectric | en_US |
dc.identifier.doi | 10.1166/jnn.2016.12596 | en_US |
dc.identifier.journal | JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY | en_US |
dc.citation.volume | 16 | en_US |
dc.citation.issue | 7 | en_US |
dc.citation.spage | 7546 | en_US |
dc.citation.epage | 7550 | en_US |
dc.contributor.department | 材料科學與工程學系 | zh_TW |
dc.contributor.department | 電子物理學系 | zh_TW |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Materials Science and Engineering | en_US |
dc.contributor.department | Department of Electrophysics | en_US |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000387100400132 | en_US |
顯示於類別: | 期刊論文 |