Effects of width scaling, length scaling, and layout variation on electromigrationin in dual damascene copper interconnects

Date

Authors

DOI

10.1109/RELPHY.2006.251317

URI

http://dx.doi.org/10.1109/RELPHY.2006.251317
https://ir.lib.nycu.edu.tw/handle/11536/135206

Collections

會議論文;;Conferences Paper