Effects of width scaling, length scaling, and layout variation on electromigrationin in dual damascene copper interconnects

doi:10.1109/RELPHY.2006.251317

標題:	Effects of width scaling, length scaling, and layout variation on electromigrationin in dual damascene copper interconnects
作者:	Lin, M. H. Chang, K. P. Su, K. C. Wang, Tahui 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics
公開日期:	2006
URI:	http://dx.doi.org/10.1109/RELPHY.2006.251317 http://hdl.handle.net/11536/135206
ISBN:	0-7803-9498-4
ISSN:	1541-7026
DOI:	10.1109/RELPHY.2006.251317
期刊:	2006 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 44TH ANNUAL
起始頁:	671
結束頁:	+
顯示於類別：	會議論文