Logic/Memory Hybrid 3D Sequentially Integrated Circuit Using Low Thermal Budget Laser Process

Abstract

High performance 3D sequentially stackable nanowire FETs and non-volatile memories (NVMs) with threshold voltage engineering and driving current boosting technologies were demonstrated by using low thermal budget nanosecond laser crystallization and laser activation technologies. The local heating laser process without damaging the underlying device/circuit realizes the across -layer and in -layer integration of high-speed 3ps logic circuits and 1-T 100ns plasma-MONOS NVMs as well as low driving-voltage 6T SRAMs with static noise margin (SNM) of 280 mV. Such logic/memory hybrid 3D sequentially integrated circuit provides power efficient computing and storage. Moreover, the monolithically stacking of Si thin-film energy harvester envisions lower power and low cost 3D(+)IC for internet of things.