標題: A Novel Composite Bump Design for Chip-on-Glass Package Using Non-Conductive Adhesive Film
作者: Tang, Pao-Yun
Sun, Wei-Hao
Yang, Kei-Hsiung
交大名義發表
National Chiao Tung University
公開日期: 1-Jan-2009
摘要: A novel composite bump, Smart bump, structure has been successfully developed for chip-on-glass (COG) package using non-conductive adhesive film (NCF). We have successfully verified the low contact resistance and high reliabilities using Smart bump and COG NCF process for the packages of 17"W, 12.1" and 2.4" TFT-LCD modules. We have realized that COG NCF process with Smart bump is simpler and lower cost in consumable materials than the conventional COG ACF process with Au bump. The COG NCF process also allows fine-pitch-driver package for high-resolution TFT-LCDs, and has a higher process yield in pilot production.
URI: http://hdl.handle.net/11536/146257
期刊: 2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III
起始頁: 834
Appears in Collections:Conferences Paper