標題: An Implantable 128-Channel Wireless Neural-Sensing Microsystem using TSV-Embedded Dissolvable mu-Needle Array and Flexible Interposer
作者: Huang, Po-Tsang
Huang, Yu-Chieh
Wu, Shang-Lin
Hu, Yu-Chen
Lu, Ming-Wei
Sheng, Ting-Wei
Chang, Fung-Kai
Lin, Chun-Pin
Chang, Nien-Shang
Chen, Hung-Lieh
Chen, Chi-Shi
Duann, Jeng-Ren
Chiu, Tzai-Wen
Hwang, Wei
Chen, Kuan-Neng
Chuang, Ching-Te
Chiou, Jin-Chern
生物科技學系
電子工程學系及電子研究所
電控工程研究所
國際半導體學院
Department of Biological Science and Technology
Department of Electronics Engineering and Institute of Electronics
Institute of Electrical and Control Engineering
International College of Semiconductor Technology
公開日期: 1-Jan-2017
摘要: For implanted neural-sensing devices, one of the remaining challenges is to transmit stable power/data (P/D) transmission for high spatiotemporal resolution neural data. This paper presents a miniaturized implantable 128-channel wireless neural-sensing microsystem using TSV-embedded dissolvable mu-needle array, a flexible interposer and 4 dies by 2.5D/3D TSV heterogeneous SiP technology. The 4 dies are 2 neural-signal acquisition ICs implemented by 90nm CMOS, 1 neural-signal processor by 40nm CMOS and 1 wireless P/D transmission circuitry by 0.18 mu m CMOS. Thus, the proposed wireless microsystem realizes 128-channel neural-signal sensing within the area of 5mm x 5mm, neural feature extraction and wireless P/D transmission using an on-interposer inductor. The overall average power of the circuits in this microsystem is only 9.85mW.
URI: http://hdl.handle.net/11536/146926
ISSN: 0271-4302
期刊: 2017 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS)
Appears in Collections:Conferences Paper