標題: Development and Investigation of Ultra-Thin Buffer Layers Used in Symmetric Cu/Sn Bonding and Asymmetric Cu/Sn-Cu Bonding for Advanced 3D Integration Applications
作者: Chen, Hsiu-Chi
Kho, Yi-Tung
Huang, Yen-Jun
Hsieh, Yu-Sheng
Chang, Yao-Jen
Tang, Ya-Sheng
Yu, Ting-Yang
Chen, Kuan-Neng
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 1-Jan-2017
摘要: In this work, a particular ultra-thin buffer layer (UBL) with various thickness ranging from 10 nm to 100 nm and different materials including Co, Ni, Pd and Ti is inserted between Cu/Sn to delay the interdiffusion prior to eutectic bonding. The efficacy of the buffer layer and the bonding quality are systematically conferred using microstructure imaging, material analysis, and electrical performance. In addition to symmetric Cu/Sn bonding with UBL, an asymmetric Cu/Sn-Cu bonding which is proposed to relieve the heat enhanced interdiffUsion issues thereby enhancing the reliability performance is demonstrated with the assistance of UBL technology.
URI: http://hdl.handle.net/11536/147172
ISSN: 2150-5934
期刊: 2017 12TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT)
起始頁: 85
結束頁: 88
Appears in Collections:Conferences Paper