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dc.contributor.authorLin, S. H.en_US
dc.contributor.authorLiu, S. L.en_US
dc.contributor.authorYeh, F. S.en_US
dc.contributor.authorChin, Alberten_US
dc.date.accessioned2019-04-02T06:00:59Z-
dc.date.available2019-04-02T06:00:59Z-
dc.date.issued2009-01-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2008.2009011en_US
dc.identifier.urihttp://hdl.handle.net/11536/149723-
dc.description.abstractWe report low-threshold-voltage (V-t) TaN/HfLaO n-MOSFETs using solid-phase-diffusion (SPD)-formed junctions at a low temperature of 650 degrees C. The gate-first and self-aligned TaN/HflLaO n-MOSFETs using Ni/Sb SPID-formed source-drain junctions showed a low Vt of 0.16 V and a peak electron mobility of 187 cm(2)/V . s at a small 1.3-nm equivalent oxide thickness.en_US
dc.language.isoen_USen_US
dc.subjectHfLaOen_US
dc.subjectlow V-ten_US
dc.subjectsolid-phase diffusion (SPD)en_US
dc.titleLow-V-t TaN/HfLaO n-MOSFETs Using Low-Temperature Formed Source-Drain Junctionsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2008.2009011en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume30en_US
dc.citation.spage75en_US
dc.citation.epage77en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000262364200025en_US
dc.citation.woscount5en_US
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