標題: HEAT CONDUCTING MODULE
作者: Chi-Chuan WANG
Kuo-Wei LIN
公開日期: 2-Mar-2017
摘要: A heat conducting module includes a main body. The main body includes a first surface and a second surface. The first surface is thermally connected to a heat absorbing body. The second surface is opposite to the first surface and is fluidly connected to a channel. The second surface has a plurality of grooves disposed along a direction. The channel allows a fluid to flow a long the direction. Each of the grooves includes a first sub-groove and at least one second sub-groove. The first sub-groove at least has a third surface close to the first surface. The first sub-groove at least partially communicates with the second sub-groove, and the second sub-groove is at least partially fluidly connected with the third surface.
官方說明文件#: H05K007/20
URI: http://hdl.handle.net/11536/151256
專利國: USA
專利號碼: 20170064866
Appears in Collections:Patents


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