| 標題: | HEAT CONDUCTING MODULE |
| 作者: | Chi-Chuan WANG Kuo-Wei LIN |
| 公開日期: | 2-三月-2017 |
| 摘要: | A heat conducting module includes a main body. The main body includes a first surface and a second surface. The first surface is thermally connected to a heat absorbing body. The second surface is opposite to the first surface and is fluidly connected to a channel. The second surface has a plurality of grooves disposed along a direction. The channel allows a fluid to flow a long the direction. Each of the grooves includes a first sub-groove and at least one second sub-groove. The first sub-groove at least has a third surface close to the first surface. The first sub-groove at least partially communicates with the second sub-groove, and the second sub-groove is at least partially fluidly connected with the third surface. |
| 官方說明文件#: | H05K007/20 |
| URI: | http://hdl.handle.net/11536/151256 |
| 專利國: | USA |
| 專利號碼: | 20170064866 |
| 顯示於類別: | 專利資料 |

