完整後設資料紀錄
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dc.contributor.authorChen, Jie-Tingen_US
dc.contributor.authorKer, Ming-Douen_US
dc.date.accessioned2019-08-02T02:18:28Z-
dc.date.available2019-08-02T02:18:28Z-
dc.date.issued2019-06-01en_US
dc.identifier.issn1530-4388en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TDMR.2019.2903209en_US
dc.identifier.urihttp://hdl.handle.net/11536/152301-
dc.description.abstractTo effectively protect the interface circuit between separated power domains from electrostatic discharge (ESD) damage, a new diode-triggered quad-silicon-controlled rectifier (DTQSCR) is proposed and realized in a 0.18-mu m 1.8-V/3.3-V CMOS process. Since the DTQSCR embeds four silicon-controlled rectifier paths and a structure of back-to-back diodes, the silicon area can be efficiently reduced more than 30% as compared to the traditional ESD protection design under the same ESD specification. From the measurement results in silicon chip, an interface circuit (level shifter) with the proposed ESD protection design can successfully sustain a human-body-model of greater than 5.5 kV. The proposed ESD protection device is suitable to protect the interface circuits between different power domains.en_US
dc.language.isoen_USen_US
dc.subjectElectrostatic discharge (ESD)en_US
dc.subjectESD protectionen_US
dc.subjectseparated power domainsen_US
dc.subjectsilicon-controlled rectifier (SCR)en_US
dc.titleESD Protection Design With Diode-Triggered Quad-SCR for Separated Power Domainsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TDMR.2019.2903209en_US
dc.identifier.journalIEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITYen_US
dc.citation.volume19en_US
dc.citation.issue2en_US
dc.citation.spage283en_US
dc.citation.epage289en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000471007800007en_US
dc.citation.woscount0en_US
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