標題: High-toughness (111) nano-twinned copper lines for fan-out wafer-level packaging
作者: Li, Yu-Jin
Hsu, Wei-Yu
Lin, Benson
Chang, ChiaCheng
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: nano-twinned;fan-out;TCT;reliability
公開日期: 1-Jan-2019
摘要: In the present paper, the nt-Cu were electroplated on the InFO test vehicles with 5 mu m line width to compare the reliability with the normal electroplated copper. The temperature of the TCT ranges from -55 to 125 degrees C. The microstructure of the copper traces after 200 cycles and 1000 cycles was shown in the results. The nt-Cu RDL is much stronger than the normal Cu in the thermal cycling test. In order to understand the mechanical property of the nt-Cu and the normal Cu, tensile tests of electroplated copper foils was employed. After annealing at 250 degrees C for 3 hours, the toughness of nt-Cu (about 60MJ/m(3)) is much higher than normal copper (about 30MJ/m(3)). In addition, the simulation results shows that the maximum stress on the copper trace during the TCT is about 200MPa which is much lower than the yield point of nt-Cu. In other word, the nt-Cu would return to original size when the stress removed without strain accumulation. In summary, we observed that the nt-Cu performs much better than normal copper in TCT. From the tensile test and simulation, we can understand the mechanical behavior and the typical reason for the high reliability of nt-Cu.
URI: http://hdl.handle.net/11536/153319
ISBN: 978-4-9902-1887-4
期刊: 2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019)
起始頁: 251
結束頁: 254
Appears in Collections:Conferences Paper