Built-In Self-Test/Repair Methodology for Multiband RF-Interconnected TSV 3D Integration

doi:10.1109/MDAT.2019.2932935

Title:	Built-In Self-Test/Repair Methodology for Multiband RF-Interconnected TSV 3D Integration
Authors:	Cheng, Shu-Feng Huang, Po-Tsang Wang, Li-Chun Chang, Mau-Chung Frank 交大名義發表電機資訊學士班電機工程學系國際半導體學院 National Chiao Tung University Undergraduate Honors Program of Electrical Engineering and Computer Science Department of Electrical and Computer Engineering International College of Semiconductor Technology
Keywords:	Through-silicon vias;Built-in self-test;Maintenance engineering;Three-dimensional displays;Circuit faults;Bandwidth;Frequency division multiplexing;multiband RF-Interconnect;test methodology;TSV density;yield improvement;PRBS;phase error;BIST;R;e-fuse
Issue Date:	1-Dec-2019
Abstract:	Editor's note: Multiband radio-frequency interconnect (MRFI) is an emerging technology to achieve low-latency and energy-efficient on-chip communication. This article proposes a BIST method to improve the reliability of MRFI-based design. -Partha Pratim Pande, Washington State University
URI:	http://dx.doi.org/10.1109/MDAT.2019.2932935 http://hdl.handle.net/11536/153438
ISSN:	2168-2356
DOI:	10.1109/MDAT.2019.2932935
Journal:	IEEE DESIGN & TEST
Volume:	36
Issue:	6
Begin Page:	63
End Page:	71
Appears in Collections:	Articles