標題: | Built-In Self-Test/Repair Methodology for Multiband RF-Interconnected TSV 3D Integration |
作者: | Cheng, Shu-Feng Huang, Po-Tsang Wang, Li-Chun Chang, Mau-Chung Frank 交大名義發表 電機資訊學士班 電機工程學系 國際半導體學院 National Chiao Tung University Undergraduate Honors Program of Electrical Engineering and Computer Science Department of Electrical and Computer Engineering International College of Semiconductor Technology |
關鍵字: | Through-silicon vias;Built-in self-test;Maintenance engineering;Three-dimensional displays;Circuit faults;Bandwidth;Frequency division multiplexing;multiband RF-Interconnect;test methodology;TSV density;yield improvement;PRBS;phase error;BIST;R;e-fuse |
公開日期: | 1-十二月-2019 |
摘要: | Editor's note: Multiband radio-frequency interconnect (MRFI) is an emerging technology to achieve low-latency and energy-efficient on-chip communication. This article proposes a BIST method to improve the reliability of MRFI-based design. -Partha Pratim Pande, Washington State University |
URI: | http://dx.doi.org/10.1109/MDAT.2019.2932935 http://hdl.handle.net/11536/153438 |
ISSN: | 2168-2356 |
DOI: | 10.1109/MDAT.2019.2932935 |
期刊: | IEEE DESIGN & TEST |
Volume: | 36 |
Issue: | 6 |
起始頁: | 63 |
結束頁: | 71 |
顯示於類別: | 期刊論文 |