標題: Built-In Self-Test/Repair Methodology for Multiband RF-Interconnected TSV 3D Integration
作者: Cheng, Shu-Feng
Huang, Po-Tsang
Wang, Li-Chun
Chang, Mau-Chung Frank
交大名義發表
電機資訊學士班
電機工程學系
國際半導體學院
National Chiao Tung University
Undergraduate Honors Program of Electrical Engineering and Computer Science
Department of Electrical and Computer Engineering
International College of Semiconductor Technology
關鍵字: Through-silicon vias;Built-in self-test;Maintenance engineering;Three-dimensional displays;Circuit faults;Bandwidth;Frequency division multiplexing;multiband RF-Interconnect;test methodology;TSV density;yield improvement;PRBS;phase error;BIST;R;e-fuse
公開日期: 1-Dec-2019
摘要: Editor's note: Multiband radio-frequency interconnect (MRFI) is an emerging technology to achieve low-latency and energy-efficient on-chip communication. This article proposes a BIST method to improve the reliability of MRFI-based design. -Partha Pratim Pande, Washington State University
URI: http://dx.doi.org/10.1109/MDAT.2019.2932935
http://hdl.handle.net/11536/153438
ISSN: 2168-2356
DOI: 10.1109/MDAT.2019.2932935
期刊: IEEE DESIGN & TEST
Volume: 36
Issue: 6
起始頁: 63
結束頁: 71
Appears in Collections:Articles