標題: High Electromigration Lifetimes of Nanotwinned Cu Redistribution Lines
作者: Tseng, I-Hsin
Li, Yu-Jin
Lin, Benson
Chang, Chia-Cheng
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 1-Jan-2019
摘要: In this paper, we measured the electromigration lifetimes for nanotwinned copper (nt-Cu) and regular copper redistribution lines (RDLs) for 3D-ICs packaging. The width of the RDLs is 10 mu m in width and 5 mu m in thickness, and the lines were coated by polyimide. The average lifetime of the nt-Cu RDL copper line is 445 hours to reach 1.2 times of its initial resistance. However, it takes 160 hours to reach the same resistance increase for regular copper RDL line. The nt-Cu has better EM lifetime than regular copper.
URI: http://dx.doi.org/10.1109/ECTC.2019.00206
http://hdl.handle.net/11536/153660
ISBN: 978-1-7281-1498-9
ISSN: 0569-5503
DOI: 10.1109/ECTC.2019.00206
期刊: 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
起始頁: 1328
結束頁: 0
Appears in Collections:Conferences Paper