標題: An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications
作者: Lin, Yu-Min
Wu, Sheng-Tsai
Wang, Chun-Min
Lee, Chia-Hsin
Huang, Shin-Yi
Lin, Ang-Ying
Chang, Tao-Chih
Lin, Puru Bruce
Ko, Cheng-Ta
Chen, Yu-Hua
Su, Jay
Liu, Xiao
Prenger, Luke
Chen, Kuan-Neng
交大名義發表
National Chiao Tung University
關鍵字: Fan-out panel-level packaging;FO-WLP;Process development;finite element analysis (FEA);warpage
公開日期: 1-Jan-2019
摘要: Technologies of Fan-outpanel-level packaging (FOPLP) are studies in this paper. First, the warpage control of a molded panel is a crucial problem for FOWLP technology development. In this paper, finite element analysis (FEA) is applied to study the influence of back end of the line (BEOL) process-induced warpage, as well as characterization for simulation, and investigation of each single process. In our process, a liquid release material is coated onto a 370 mm x 470 mm glass carrier. After baking, three layers of redistribution layer (RDL), passivation, and Cu leads are fabricated on the panel with coating, exposing, developing, lithography, and electroplating processes. Silicon test chips with a size of 16 mm x 10 mm and micro solder bumps with a pitch of 90 mu m are thinned down to 150 mu m. Test chips are then flip-chip bonded onto glass carrier with pre-bond and reflow proces. After panel molding, a laser debonding method, another key technology advancement, is utilized for panel debond. Debond performance, which is directly related to laser parameter and panel-level package (PLP) structure, is critical. After debonding, the molded panel is cleaned, followed by dicing and OSP coating processes, and then the electrical performance of the interconnection is evaluated. Reliability tests at the component level, such as pre-condition, thermal cycling test (TCT), and unbiased HAST (uHAST), are performed. The demonstration of RDL-first PLP technology without interposers proves its great potential in heterogeneous integration applications.
URI: http://dx.doi.org/10.1109/ECTC.2019.00225
http://hdl.handle.net/11536/153661
ISBN: 978-1-7281-1498-9
ISSN: 0569-5503
DOI: 10.1109/ECTC.2019.00225
期刊: 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
起始頁: 1463
結束頁: 1469
Appears in Collections:Conferences Paper