標題: Non-Planarization Cu-Cu Direct Bonding and Gang Bonding with Low Temperature and Short Duration in Ambient Atmosphere
作者: Chou, Tzu-Chieh
Yang, Kai-Ming
Li, Jian-Chen
Yu, Ting-Yang
Chung, Ying-Ting
Ko, Cheng-Ta
Chen, Yu-Hua
Tseng, Tzyy-Jang
Chen, Kuan-Neng
交大名義發表
National Chiao Tung University
公開日期: 1-Jan-2019
摘要: Low temperature (150 degrees C) and short duration Cu-Cu direct bonding, without planarization, and gang bonding approaches are demonstrated with excellent bond strength, electrical characteristics, and reliability. The concept is based on the high stress-led inducing deformation and internal friction to achieve low temperature bonding. In addition, the bonding structure has the advantage of high roughness tolerance on surface without CMP requirement. Compared to current products using Cu-Cu direct bonding at 350-400 degrees C with long duration and vacuum requirement, the breakthrough of proposed schemes provides the feasibility for product realization in 3D integration packaging.
URI: http://hdl.handle.net/11536/155251
ISBN: 978-1-7281-4031-5
ISSN: 2380-9248
期刊: 2019 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)
起始頁: 0
結束頁: 0
Appears in Collections:Conferences Paper