標題: | Transient Thermal Damage Simulation for Novel Location-Controlled Grain Technique in Monolithic 3D IC |
作者: | Chen, Pin-Jun Shen, Chih-Ming Yang, Chih-Chao Tai, Ming-Chi Lo, Wei-Chung Shen, Chang-Hong Hu, Chenming Chen, Kuan-Neng 國際半導體學院 International College of Semiconductor Technology |
公開日期: | 1-一月-2019 |
摘要: | In this research, Finite Element Method (FEM) is used to simulate transient thermal conduction in the monolithic three-dimensional integrated circuit (3DIC) with a novel location-controlled-grain (LCG) technique. Through this method, the impact of laser flux, amorphous Si thickness and interlayer dielectric (ILD) thickness on that model can be investigated. Furthermore, with the assistance of thermal damage simulation, we can utilize the optimal process parameters in this state-of-the-art technique to accelerate the development of advanced semiconductor technologies. |
URI: | http://hdl.handle.net/11536/155282 |
ISBN: | 978-1-7281-6070-2 |
ISSN: | 2150-5934 |
期刊: | 2019 14TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT 2019) |
起始頁: | 104 |
結束頁: | 107 |
顯示於類別: | 會議論文 |