標題: Thermal-Aware Logic Block Placement for 3D FPGAs Considering Lateral Heat Dissipation
作者: Huang, Juinn-Dar
Huang, Ya-Shih
Hsu, Mi-Yu
Chang, Han-Yuan
交大名義發表
National Chiao Tung University
關鍵字: Three-dimensional integration;3D FPGAs;thermal-aware placement;logic block placement
公開日期: 2012
URI: http://hdl.handle.net/11536/16229
ISBN: 978-1-4503-1155-7
期刊: FPGA 12: PROCEEDINGS OF THE 2012 ACM-SIGDA INTERNATIONAL SYMPOSIUM ON FIELD PROGRAMMABLE GATE ARRAYS
結束頁: 268
Appears in Collections:Conferences Paper