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dc.contributor.authorTsai, C. Y.en_US
dc.contributor.authorCheng, C. H.en_US
dc.contributor.authorChang, T. Y.en_US
dc.contributor.authorChou, K. Y.en_US
dc.contributor.authorChin, Alberten_US
dc.contributor.authorYeh, F. S.en_US
dc.date.accessioned2014-12-08T15:23:05Z-
dc.date.available2014-12-08T15:23:05Z-
dc.date.issued2011en_US
dc.identifier.isbn978-1-60768-257-8en_US
dc.identifier.issn1938-5862en_US
dc.identifier.urihttp://hdl.handle.net/11536/16235-
dc.description.abstractWe report a flash memory using deep traps nano-dot formed in ZrON charge trapping layers by As+ implantation to improve the device performance of MONOS CTF device. The TaN-[SiO2-LaAlO3]-[As+-implanted ZrON]-[LaAlO3-SiO2]-Si device shows a 6 nm ENT, a large initial memory window of 9.8 V, a 10-year extrapolated retention window of 3.6 V at 85 degrees C, and an endurance window of 5.1 V after 10(5) cycles under fast 100 mu s and low +/- 16 V program/erase. The performance of As+-implanted ZrON is significantly better than that of stacked Si3N4/Ir-dot/HfON device with poor thickness scaling due to excess Ir metal dot.en_US
dc.language.isoen_USen_US
dc.titleSize-Dependent Trapping Effect in Nano-Dot Non-Volatile Memoryen_US
dc.typeProceedings Paperen_US
dc.identifier.journalPHYSICS AND TECHNOLOGY OF HIGH-K MATERIALS 9en_US
dc.citation.volume41en_US
dc.citation.issue3en_US
dc.citation.epage121en_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000304670400014-
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