Low voltage high speed SiO(2)/AlGaN/AlLaO(3)/TaN memory with good retention

Abstract

To improve trapping using deeper well AlGaN (chi=3.8eV), lower voltage drop in high-K AlLaO(3) barrier (kappa=23), and smaller erase current by large Delta E(c) of AILaO(3)/TaN, the SiO(2)/AlGaN/AlLaO(3)/TaN devices show good 85 degrees C memory integrity of low +/- 10V 1ms P/E, large 3.9V initial Delta V(th) and 2.4V extrapolated 10-year retention. A fast 100ps P/E of +/- 11V still gives 3.0V initial Delta V(th) and 1.6V 10-year retention.