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dc.contributor.authorKuo, HCen_US
dc.contributor.authorChang, YHen_US
dc.contributor.authorChang, YAen_US
dc.contributor.authorTseng, KFen_US
dc.contributor.authorLaih, LHen_US
dc.contributor.authorWang, SCen_US
dc.contributor.authorYu, HCen_US
dc.contributor.authorSung, CPen_US
dc.contributor.authorYang, HPen_US
dc.date.accessioned2014-12-08T15:25:16Z-
dc.date.available2014-12-08T15:25:16Z-
dc.date.issued2005en_US
dc.identifier.isbn0-8194-5578-4en_US
dc.identifier.issn0277-786Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/17645-
dc.identifier.urihttp://dx.doi.org/10.1117/12.577050en_US
dc.description.abstractIn this paper, we demonstrate high performance 850 nm InGaAsP/InGaP strain-compensated MQWs vertical-cavity surface-emitting lasers (VCSELs). These VCSELs exhibit superior performance with threshold currents of similar to 0.4 mA, and slope efficiencies of similar to 0.6 mW/mA. High modulation bandwidth of 14.5 GHz and modulation current efficiency factor of 11.6 GHz/(mA)(1/2) are demonstrated. We have accumulated life test data up to 1000 hours at 70 degrees C/8mA. In addition, we also report a high speed planarized 850nm oxide-implanted VCSELs process that does not require semiinsulating substrates, polyimide planarization process, or very small pad areas, therefore very promising in mass manufacture.en_US
dc.language.isoen_USen_US
dc.subjectstrain-compensateden_US
dc.subjectrgh-speed electronicsen_US
dc.subjectVCSELsen_US
dc.subjectInGaAsP/InGaPen_US
dc.subjectproton-implanten_US
dc.titleFabrication of high speed and reliable 850nm oxide-confined VCSELs for 10Gb/s data communicationen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1117/12.577050en_US
dc.identifier.journalSEMICONDUCTOR AND ORGANIC OPTOELECTRONIC MATERIALS AND DEVICESen_US
dc.citation.volume5624en_US
dc.citation.spage50en_US
dc.citation.epage57en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000227356100006-
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