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dc.contributor.authorYang, Hao-Ien_US
dc.contributor.authorChuang, Ching-Teen_US
dc.contributor.authorHwang, Weien_US
dc.date.accessioned2014-12-08T15:25:19Z-
dc.date.available2014-12-08T15:25:19Z-
dc.date.issued2009en_US
dc.identifier.isbn978-1-4244-2933-2en_US
dc.identifier.urihttp://hdl.handle.net/11536/17702-
dc.description.abstractThis paper presents a detailed analysis on the impacts of various gate-oxide breakdown (BD) paths in column-based header- and footer-gated SRAMs. It is shown that with gate-oxide BD, the RSNM (Read Static Noise Margin) degrades, while the WM (Write Margin) improves in general. The effects of gate-to-source BD of cell transistors are shown to confine to the individual cell, while multiple cells suffering cell transistor drain-to-drain BD in a column could cumulatively affect VVDD (header structure) or VVSS (footer structure), thus influencing other cells in the same column. In particular, we show that the gate-oxide BD of the power-switches have server and even detrimental effects on the margin, stability, and performance of the SRAM arrayen_US
dc.language.isoen_USen_US
dc.subjectgate-oxide breakdownen_US
dc.subjectpower gating technologyen_US
dc.subjectSRAMen_US
dc.titleImpact of Gate-Oxide Breakdown on Power-Gated SRAMen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2009 IEEE INTERNATIONAL CONFERENCE ON INTEGRATED CIRCUIT DESIGN AND TECHNOLOGY, PROCEEDINGSen_US
dc.citation.spage93en_US
dc.citation.epage96en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000270582500024-
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