METALLURGICAL REACTIONS AT THE INTERFACE OF SN/PB SOLDER AND ELECTROLESS COPPER-PLATED ALN SUBSTRATE

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	CHIOU, BS	en_US
dc.contributor.author	CHANG, JH	en_US
dc.contributor.author	DUH, JG	en_US
dc.date.accessioned	2014-12-08T15:03:14Z	-
dc.date.available	2014-12-08T15:03:14Z	-
dc.date.issued	1995-08-01	en_US
dc.identifier.issn	1070-9894	en_US
dc.identifier.uri	http://hdl.handle.net/11536/1802	-
dc.description.abstract	Intermetallic formation between electroless-plated copper and Sn/Pb solder is investigated. An interlayer is formed between copper and solder, and segregation of Pb-rich and Sn-rich phases are observed. X-ray diffraction and EDX analysis results suggest that the major intermetallic formed in the interlayer is Cu6Sn5. For the as-plated sample, the adhesion strength of Cu to the AIN substrate after 150 degrees C aging is affected by both the recrystallization and the creep of copper. For the soldered specimen, the presence of intermetallic compound causes cracks to propagate along the intermetallic/Cu interface and results in a decrease of the adhesion strength.	en_US
dc.language.iso	en_US	en_US
dc.title	METALLURGICAL REACTIONS AT THE INTERFACE OF SN/PB SOLDER AND ELECTROLESS COPPER-PLATED ALN SUBSTRATE	en_US
dc.type	Article	en_US
dc.identifier.journal	IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING	en_US
dc.citation.volume	18	en_US
dc.citation.issue	3	en_US
dc.citation.spage	537	en_US
dc.citation.epage	542	en_US
dc.contributor.department	電子工程學系及電子研究所	zh_TW
dc.contributor.department	Department of Electronics Engineering and Institute of Electronics	en_US
dc.identifier.wosnumber	WOS:A1995RN87900019	-
dc.citation.woscount	19	-
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