标题: Scrap rules for small lots in wafer fabrication
作者: Wu, MC
Chiou, CW
Hsu, HM
工业工程与管理学系
Department of Industrial Engineering and Management
公开日期: 2002
摘要: This paper presents a genetic algorithm for determining the-rules for scrapping small lots in a semiconductor fab. Small lots are lots which carry less than 25 wafers due to yield problem. Simulation results show that the proposed approach can increase contribution margin up to 24% in the case of low yield and high average, selling price.
URI: http://hdl.handle.net/11536/18933
ISBN: 0-7803-7604-8
期刊: 2002 SEMICONDUCTOR MANUFACTURING TECHNOLOGY WORKSHOP
起始页: 187
结束页: 190
显示于类别:Conferences Paper