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dc.contributor.authorCheng, YCen_US
dc.contributor.authorChen, WJen_US
dc.contributor.authorLin, BCen_US
dc.contributor.authorTsai, Cen_US
dc.contributor.authorChin, Aen_US
dc.date.accessioned2014-12-08T15:27:15Z-
dc.date.available2014-12-08T15:27:15Z-
dc.date.issued1998en_US
dc.identifier.isbn0-7803-4306-9en_US
dc.identifier.urihttp://hdl.handle.net/11536/19489-
dc.identifier.urihttp://dx.doi.org/10.1109/ICSICT.1998.785875en_US
dc.description.abstractThe device performance made by thin gate oxide is related to the oxide thickness uniformity and the interface smoothness. Unfortunately, native oxide roughens the initial surface before thermal oxidation. in this paper, we have designed a leak-tight low-pressure N2O oxidation system, and the native oxide is desorbed in-situ under H-2 environment, Atomically smooth oxide and Si interface of ultra-thill oxides (11-38 Angstrom) were achieved as observed by high-resolutional TEM. Significant mobility enhancement over large gate field is obtained by reducing interface roughness scattering. The oxide reliability is also improved by this smoother interface between Si and oxide.en_US
dc.language.isoen_USen_US
dc.titleMobility and oxide breakdown behavior in ultra-this oxide with atomically smooth interfaceen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/ICSICT.1998.785875en_US
dc.identifier.journal1998 5TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY PROCEEDINGSen_US
dc.citation.spage283en_US
dc.citation.epage286en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000080928800077-
Appears in Collections:Conferences Paper


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