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dc.contributor.authorChin, Aen_US
dc.contributor.authorChen, WJen_US
dc.contributor.authorKao, RHen_US
dc.contributor.authorLin, BCen_US
dc.contributor.authorChang, Ten_US
dc.contributor.authorTsai, Cen_US
dc.contributor.authorHuang, JCMen_US
dc.date.accessioned2014-12-08T15:27:49Z-
dc.date.available2014-12-08T15:27:49Z-
dc.date.issued1995en_US
dc.identifier.isbn0-7803-4131-7en_US
dc.identifier.urihttp://hdl.handle.net/11536/20055-
dc.description.abstractNative oxide is an important issue for ultra-thin oxide, which is strongly related to the gate oxide integrity such as Q(BD), interface scattering, etc. We have designed a leak-tight low-pressure oxidation system to desorb the native oxide in-situ. Atomically flat interfaces between oxide and Si are obtained for oxide thicknesses of 11 and 38 Angstrom. Because of the smooth interface and good thickness uniformity of oxide, both high-field electron mobility and oxide breakdown behavior are much improved.en_US
dc.language.isoen_USen_US
dc.titleUltra-thin oxide with atomically smooth interfacesen_US
dc.typeProceedings Paperen_US
dc.identifier.journal1997 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS, AND APPLICATIONS, PROCEEDINGS OF TECHNICAL PAPERSen_US
dc.citation.spage177en_US
dc.citation.epage181en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1995BJ34C00038-
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