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dc.contributor.authorLee, Wan-Yuen_US
dc.contributor.authorJiang, Iris Hui-Ruen_US
dc.contributor.authorMei, Tsung-Wanen_US
dc.date.accessioned2014-12-08T15:28:32Z-
dc.date.available2014-12-08T15:28:32Z-
dc.date.issued2012-11-01en_US
dc.identifier.issn1016-2364en_US
dc.identifier.urihttp://hdl.handle.net/11536/20636-
dc.description.abstractThe success of 3D IC requires novel EDA techniques. Although many EDA techniques exist, this paper focuses on 3D IC partitioning, especially at the architectural level to maximize its benefits. First, logical formulations for 3D IC partitioning problems are derived and then the formulations are transformed into integer linear programs (ILPs). The ILP formulation can minimize the usage of vertical interconnects subject to the footprint and power consumption constraints. The flexibility of ILP formulation can be demonstrated by extending the generic ILP formulation to support designs with multiple supply voltages. This study proposes ILP reduction techniques to speed up the convergence. Experimental results based on the GSRC benchmark show that our approach converges efficiently. Moreover, our approach is flexible and can readily extend to the partitioning problems with variant objectives and constraints, and with different abstraction levels, for example, from the architectural level down to the physical level. This flexibility makes the ILP formulation a superior alternative to 3D IC partitioning problems.en_US
dc.language.isoen_USen_US
dc.subject3D ICen_US
dc.subjectpartitioningen_US
dc.subjectinteger linear programen_US
dc.subjectthrough-silicon viaen_US
dc.subjectalgorithmsen_US
dc.titleGeneric Integer Linear Programming Formulation for 3D IC Partitioningen_US
dc.typeArticleen_US
dc.identifier.journalJOURNAL OF INFORMATION SCIENCE AND ENGINEERINGen_US
dc.citation.volume28en_US
dc.citation.issue6en_US
dc.citation.spage1129en_US
dc.citation.epage1144en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000311584100009-
dc.citation.woscount0-
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