Title: Eliminate Kirkendall voids in solder reactions on nanotwinned copper
Authors: Liu, Tao-Chi
Liu, Chien-Min
Huang, Yi-Sa
Chen, Chih
Tu, King-Ning
材料科學與工程學系
Department of Materials Science and Engineering
Keywords: Kirkendall voids;Twinning;Copper;Nanostructured materials;Diffusion
Issue Date: 1-Mar-2013
Abstract: Electroplating was used to fabricate a high density of nanotwins that exhibited the preferred (111) orientation in Cu. We found no formation of Kirkendall voids in solder reactions on the nanotwinned Cu. This was due to the high density of steps and kinks on the nanotwin boundaries, which serve as vacancy sinks. Thus the vacancy concentration cannot reach supersaturation and nucleate voids. The finding is a significant advance in the problem of solder joint reliability in microelectronic three-dimensional integrated circuit devices. (c) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
URI: http://dx.doi.org/10.1016/j.scriptamat.2012.10.024
http://hdl.handle.net/11536/21014
ISSN: 1359-6462
DOI: 10.1016/j.scriptamat.2012.10.024
Journal: SCRIPTA MATERIALIA
Volume: 68
Issue: 5
Begin Page: 241
End Page: 244
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