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dc.contributor.authorHu, Vita Pi-Hoen_US
dc.contributor.authorFan, Ming-Longen_US
dc.contributor.authorSu, Pinen_US
dc.contributor.authorChuang, Ching-Teen_US
dc.date.accessioned2014-12-08T15:30:30Z-
dc.date.available2014-12-08T15:30:30Z-
dc.date.issued2013-01-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2012.2228863en_US
dc.identifier.urihttp://hdl.handle.net/11536/21790-
dc.description.abstractOptimized threshold voltage (Vt) design to enhance the variation immunity of high-performance (super-threshold) and low-voltage (near-/sub-threshold) 6 T SRAM cells is presented. For low-voltage SRAM cells operating at low Vdd, low-Vt design shows smaller variability, while the design tradeoff between performance and leakage should be considered. For high-performance SRAM cells operating at high Vdd, ultra-thin-body SOI SRAM cells with high-Vt design show smaller variability while sacrificing performance compared with the low-Vt design. Our study indicates that hetero-channel SRAM cells enable high-Vt design and exhibit improved Read/Write stability and performance, and maintain comparable RSNM variations for the high-performance SRAM applications.en_US
dc.language.isoen_USen_US
dc.subjectHetero-channelen_US
dc.subjectperformanceen_US
dc.subjectSRAMen_US
dc.subjectvariabilityen_US
dc.titleThreshold Voltage Design and Performance Assessment of Hetero-Channel SRAM Cellsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2012.2228863en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume60en_US
dc.citation.issue1en_US
dc.citation.spage147en_US
dc.citation.epage152en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000316816200023-
dc.citation.woscount2-
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