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dc.contributor.authorHu, Vita Pi-Hoen_US
dc.contributor.authorFan, Ming-Longen_US
dc.contributor.authorSu, Pinen_US
dc.contributor.authorChuang, Ching-Teen_US
dc.date.accessioned2014-12-08T15:32:20Z-
dc.date.available2014-12-08T15:32:20Z-
dc.date.issued2013-10-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2013.2278032en_US
dc.identifier.urihttp://hdl.handle.net/11536/22704-
dc.description.abstractWe present a comparative leakage analysis of germanium-on-insulator (GeOI) FinFET and germanium on bulk substrate FinFET (Ge bulk FinFET) at device and circuit levels. Band-to-band tunneling (BTBT) leakage-induced bipolar effect is found to result in an amplified BTBT leakage for GeOI FinFET. Device and circuit designs to mitigate the amplified BTBT leakage of GeOI FinFETs are suggested. The effectiveness of various high threshold voltage technology options including increasing channel doping, increasing gate length and drain-side underlap for leakage reduction is analyzed.en_US
dc.language.isoen_USen_US
dc.subjectBand-to-band tunneling (BTBT) leakageen_US
dc.subjectFinFETen_US
dc.subjectgermaniumen_US
dc.subjectgermanium-on-insulator (GeOI)en_US
dc.titleComparative Leakage Analysis of GeOI FinFET and Ge Bulk FinFETen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2013.2278032en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume60en_US
dc.citation.issue10en_US
dc.citation.spage3596en_US
dc.citation.epage3600en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000324928900088-
dc.citation.woscount2-
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