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dc.contributor.authorCheng, WHen_US
dc.contributor.authorWang, SCen_US
dc.contributor.authorYang, YDen_US
dc.contributor.authorChi, Sen_US
dc.contributor.authorSheen, MTen_US
dc.contributor.authorKuang, JHen_US
dc.date.accessioned2014-12-08T15:01:22Z-
dc.date.available2014-12-08T15:01:22Z-
dc.date.issued1997-11-01en_US
dc.identifier.issn1070-9894en_US
dc.identifier.urihttp://dx.doi.org/10.1109/96.641507en_US
dc.identifier.urihttp://hdl.handle.net/11536/227-
dc.description.abstractComprehensive measurements of the dependence of the weld width, penetration depth, and joint strength on the Au coating thickness in laser welding techniques for semiconductor laser packages are presented. The results obtained from the Invar-Invar joints show that the welded joints with thick Au coating exhibit narrower weld width, shallower penetration, and hence less joint strength than those the package joints with thin Au coating, A finite-element method (FEM) has been carried out on the effect of Au thickness on laser beam penetration in Invar-Invar joints, This method has been employed successfully Po predict the laser beam penetration in laser welded An-coated materials that the weld width and the penetration depth are reduced as the Au coating thickness increases, The likely cause for the reduction is the increased thermal conduction of thicker Au in the welded region, in addition to Au coating, the effect of Ni coating on laser beam penetration is also presented, Detailed knowledge of the effect of;in coating thickness on laser beam penetration is important for the practical design and fabrication of reliable optoelectronic packaging having laser welded Au-coated materials.en_US
dc.language.isoen_USen_US
dc.subjectAu coatingen_US
dc.subjectfinite-element methoden_US
dc.subjectlaser weldingen_US
dc.subjectoptoelectronic packagingen_US
dc.titleEffect of Au thickness on laser beam penetration in semiconductor laser packagesen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/96.641507en_US
dc.identifier.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGINGen_US
dc.citation.volume20en_US
dc.citation.issue4en_US
dc.citation.spage396en_US
dc.citation.epage402en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:A1997YD59000005-
dc.citation.woscount21-
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