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dc.contributor.authorLee, Chien-Pingen_US
dc.contributor.authorTao, Nick G. M.en_US
dc.contributor.authorLin, Barry Jia-Fuen_US
dc.date.accessioned2014-12-08T15:35:19Z-
dc.date.available2014-12-08T15:35:19Z-
dc.date.issued2014-04-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2014.2303981en_US
dc.identifier.urihttp://hdl.handle.net/11536/23949-
dc.description.abstractThe safe operating area (SOA) of InGaP/GaAs heterojunction bipolar transistors has been studied in detail both experimentally and theoretically. Devices without ballasting resistors were measured in dc to reveal the intrinsic SOA characteristics, which are influenced by both self-heating and the breakdown effect. Two distinct regions in the SOA boundary were observed indicating two different dominating failure mechanisms at different bias conditions. The theoretical analysis, which took into consideration all the relevant effects, was able to explain all the features in the measured results. Secondary unstable points beyond the SOA boundary were found theoretically. These secondary failure points and the gap between the two branches of the SOA boundary explain why the device failure points when measured in constant I-b mode were different from those measured in constant V-b mode.en_US
dc.language.isoen_USen_US
dc.subjectDevice ruggednessen_US
dc.subjectheterojunction bipolar transistors (HBTs)en_US
dc.subjectpower amplifiersen_US
dc.subjectsafe operating areas (SOAs)en_US
dc.titleStudies of Safe Operating Area of InGaP/GaAs Heterojunction Bipolar Transistorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2014.2303981en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume61en_US
dc.citation.issue4en_US
dc.citation.spage943en_US
dc.citation.epage949en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000333464000003-
dc.citation.woscount0-
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