標題: | Multi-Layer Adaptive Power Management Architecture for TSV 3DIC Applications |
作者: | Chang, Ming-Hung Hsieh, Wei-Chih Wu, Pei-Chen Chuang, Ching-Te Chen, Kuan-Neng Wang, Chen-Chao Ting, Chun-Yen Chen, Kua-Hua Chiu, Chi-Tsung Tong, Ho-Ming Hwang, Wei 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
公開日期: | 2013 |
摘要: | In this work, a multi-layer hierarchical distributed power delivery architecture for TSV 3DIC is proposed. By decoupling global and local power networks, the proposed power delivery architecture can be flexibly configured for different power requests. The decoupled power architectures can also greatly reduce the required decoupling capacitor sizes for voltage stabilization. Meanwhile, a multi-threshold CMOS switched capacitor DC-DC converter with up to 78% power efficiency is implemented in 65nm CMOS for hierarchical distributed power delivery architecture. An adaptive power management technique is presented to work in the local power network to increase the power efficiency. The proposed multi-layer hierarchical distributed power delivery architecture is also very useful for the heterogeneous integration in 3DIC chips. |
URI: | http://hdl.handle.net/11536/24163 |
ISBN: | 978-1-4799-0233-0 |
期刊: | 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) |
起始頁: | 1179 |
結束頁: | 1185 |
顯示於類別: | 會議論文 |