標題: Multi-Layer Adaptive Power Management Architecture for TSV 3DIC Applications
作者: Chang, Ming-Hung
Hsieh, Wei-Chih
Wu, Pei-Chen
Chuang, Ching-Te
Chen, Kuan-Neng
Wang, Chen-Chao
Ting, Chun-Yen
Chen, Kua-Hua
Chiu, Chi-Tsung
Tong, Ho-Ming
Hwang, Wei
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 2013
摘要: In this work, a multi-layer hierarchical distributed power delivery architecture for TSV 3DIC is proposed. By decoupling global and local power networks, the proposed power delivery architecture can be flexibly configured for different power requests. The decoupled power architectures can also greatly reduce the required decoupling capacitor sizes for voltage stabilization. Meanwhile, a multi-threshold CMOS switched capacitor DC-DC converter with up to 78% power efficiency is implemented in 65nm CMOS for hierarchical distributed power delivery architecture. An adaptive power management technique is presented to work in the local power network to increase the power efficiency. The proposed multi-layer hierarchical distributed power delivery architecture is also very useful for the heterogeneous integration in 3DIC chips.
URI: http://hdl.handle.net/11536/24163
ISBN: 978-1-4799-0233-0
期刊: 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
起始頁: 1179
結束頁: 1185
Appears in Collections:Conferences Paper