完整後設資料紀錄
DC 欄位語言
dc.contributor.authorWang, SDen_US
dc.contributor.authorChang, MNen_US
dc.contributor.authorChen, CYen_US
dc.contributor.authorLei, TFen_US
dc.date.accessioned2014-12-08T15:36:04Z-
dc.date.available2014-12-08T15:36:04Z-
dc.date.issued2005en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://hdl.handle.net/11536/24414-
dc.identifier.urihttp://dx.doi.org/10.1149/1.1990028en_US
dc.description.abstractScanning capacitance microscopy (SCM), combined with atomic force microscopy (AFM), was employed to investigate the dielectric breakdown phenomena in thin SiO2 films. The localized breakdown spots can be clearly imaged by the SCM technique. The spots exhibit signals with low differential capacitance (dC/dV) due to high conductivity. The diameters of these breakdown spots were approximately from 6 to 13.5 nm. Moreover, according to the corresponding AFM images, their surface morphology showed little change after the occurrence of oxide breakdown. (c) 2005 The Electrochemical Society. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleObservation of localized breakdown spots in thin SiO2 films using scanning capacitance microscopyen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1990028en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume8en_US
dc.citation.issue9en_US
dc.citation.spageG233en_US
dc.citation.epageG236en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000231259500034-
dc.citation.woscount4-
顯示於類別:期刊論文