標題: Local CDM ESD Protection Circuits for Cross-Power Domains in 3D IC Applications
作者: Chen, Shih-Hung
Linten, Dimitri
Scholz, Mirko
Huang, Yu-Ching
Hellings, Geert
Boschke, Roman
Ker, Ming-Dou
Groeseneken, Guido
交大名義發表
National Chiao Tung University
關鍵字: Electrostatic discharge (ESD);charged device model (CDM);cross-power domains ESD events;3D stacked ICs;vary-fast transmission line pulsing (vfTLP) systems
公開日期: 1-Jun-2014
摘要: CDM ESD events can be a potential threat to SoC designs or heterogeneous 3D ICs with multiple power domains. Inter-layer ( or interface) circuits may need a local CDM ESD clamp that can prevent the unexpected failure under CDM ESD stress. In this letter, two local CDM ESD clamp circuits are proposed. They show better clamping efficiency under 2-ns vfTLP stress.
URI: http://dx.doi.org/10.1109/TDMR.2014.2320538
http://hdl.handle.net/11536/24689
ISSN: 1530-4388
DOI: 10.1109/TDMR.2014.2320538
期刊: IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
Volume: 14
Issue: 2
起始頁: 781
結束頁: 783
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