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dc.contributor.authorKer, Ming-Douen_US
dc.contributor.authorChen, Wen-Yien_US
dc.contributor.authorShieh, Wuu-Trongen_US
dc.contributor.authorWei, I-Juen_US
dc.date.accessioned2014-12-08T15:37:32Z-
dc.date.available2014-12-08T15:37:32Z-
dc.date.issued2011-02-01en_US
dc.identifier.issn0018-9200en_US
dc.identifier.urihttp://dx.doi.org/10.1109/JSSC.2010.2096114en_US
dc.identifier.urihttp://hdl.handle.net/11536/25816-
dc.description.abstractFor integrated circuits (ICs) with voltage programming pin (V(PP) pin), a voltage higher than the normal power supply voltage of internal circuits is applied on the V(PP) pin to program the read-only memory (ROM). Because of the high programming voltage, the ESD diode placed from I/O pad to V(DD) cannot be applied to such V(PP) pin. In this work, a new ESD protection design is proposed to improve ESD robustness of V(PP) pin with the consideration of the mistriggering issue when V(PP) programming voltage has a fast rise time. In collaboration with the N-well ballast layout, the new proposed ESD protection design implemented in an IC product has been verified in a fully-silicided CMOS process to successfully achieve a high human-body-model ESD protection level of 5 kV.en_US
dc.language.isoen_USen_US
dc.subjectElectrostatic discharge (ESD)en_US
dc.subjectvoltage programming pin (V(PP))en_US
dc.titleElectrostatic Discharge Protection Design for High-Voltage Programming Pin in Fully-Silicided CMOS ICsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/JSSC.2010.2096114en_US
dc.identifier.journalIEEE JOURNAL OF SOLID-STATE CIRCUITSen_US
dc.citation.volume46en_US
dc.citation.issue2en_US
dc.citation.spage537en_US
dc.citation.epage545en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000286675200017-
dc.citation.woscount0-
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