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dc.contributor.authorHu, Vita Pi-Hoen_US
dc.contributor.authorFan, Ming-Longen_US
dc.contributor.authorSu, Pinen_US
dc.contributor.authorChuang, Ching-Teen_US
dc.date.accessioned2014-12-08T15:38:27Z-
dc.date.available2014-12-08T15:38:27Z-
dc.date.issued2010en_US
dc.identifier.isbn978-1-4244-9128-5en_US
dc.identifier.issn1078-621Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/26332-
dc.description.abstractThis paper analyzes the stability, performance, and variability of 6T FinFET SRAM cells with asymmetric gate-to-source/drain underlap devices. At Vdd = 1V, using asymmetric source-underlap access transistors can improve RSNM while degrading WSNM; using source-underlap pull-up transistors can improve WSNM without sacrificing RSNM. Thus, the conflict between improving RSNM and WSNM in 6T FinFET SRAM cell can be relaxed by using the asymmetric source/drain underlap access and pull-up transistors (PUAX_Asym.). We also show, for the first time, that as Vdd is reduced (e. g. < 0.6V), the effectiveness of using asymmetric source/drain-underlap access transistors to improve RSNM diminishes due to the worse electrostatic integrity caused by the underlap. At Vdd = 1V, the 6T PUAX_Asym. SRAM cell shows 20.5% improvement in RSNM, comparable WSNM, 10% degradation in "cell" Read access time and 36% improvement in Time-to-Write compared with the conventional 6T SRAM cell (Symm.). The PUAX_Asym. SRAM cell also shows adequate mu RSNM/sigma RSNM and mu WSNM/sigma WSNM at Vdd = 1V.en_US
dc.language.isoen_USen_US
dc.titleEvaluation of Static Noise Margin and Performance of 6T FinFET SRAM Cells with Asymmetric Gate to Source/Drain Underlap Devicesen_US
dc.typeArticleen_US
dc.identifier.journal2010 IEEE INTERNATIONAL SOI CONFERENCEen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000287366100025-
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