標題: In situ characterization of CuCMP slurry and defect reduction using IR thermal camera
作者: Chan, CH
Chen, JK
Chang, FC
應用化學系
Department of Applied Chemistry
關鍵字: CuCMP;in situ slurry characterize;IR thermal camera;defect reduction
公開日期: 1-Sep-2004
摘要: In order to choose appropriate property of Cu chemical-mechanical polishing (CMP) slurry, we used IR thermal camera to distinguish this slurry that belonged to Preston or non-Preston. The adoption of the IR thermal camera is to choose suitable non-Preston Cu CMP slurry in situ and find out optimal changing timing of step endpoint. Additionally supplementing robust CMP machine, appropriate Cu film quality and pre-treatment, we could obtain a total defect number is less than 10(1) order and achieve excellent Cu CMP performance. Such Cu CMP technology resulting in Cu damascene process work and make sure 0.13 mum and beyond 100 nm Cu process to be reliable and practical. (C) 2004 Published by Elsevier B.V.
URI: http://dx.doi.org/10.1016/j.mee.2004.05.013
http://hdl.handle.net/11536/26386
ISSN: 0167-9317
DOI: 10.1016/j.mee.2004.05.013
期刊: MICROELECTRONIC ENGINEERING
Volume: 75
Issue: 3
起始頁: 257
結束頁: 262
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