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dc.contributor.authorKer, MDen_US
dc.contributor.authorLin, KHen_US
dc.date.accessioned2014-12-08T15:38:45Z-
dc.date.available2014-12-08T15:38:45Z-
dc.date.issued2004-08-01en_US
dc.identifier.issn0018-9200en_US
dc.identifier.urihttp://dx.doi.org/10.1109/JSSC.2004.831501en_US
dc.identifier.urihttp://hdl.handle.net/11536/26512-
dc.description.abstractThis paper presents a new electrostatic discharge (ESD) protection scheme for IC with power-down-mode operation. Adding a VDD ESD bus line and diodes into the proposed ESD protection scheme can block the leakage current from I/O pin to VDD power line and avoid malfunction during power-down operation. The whole-chip ESD protection design can be achieved by insertion of ESD clamp circuits between VSS power line and both the VDD power line and VDD ESD bus line. Experiment results show that the human-body model (HBM) ESD level of this new scheme can be greater than 7.5 kV in a 0.35-mum silicided CMOS process.en_US
dc.language.isoen_USen_US
dc.subjectelectrostatic discharge (ESD)en_US
dc.subjectESD busen_US
dc.subjectESD protection schemeen_US
dc.subjectleakage currenten_US
dc.subjectpower-down modeen_US
dc.titleDesign on ESD protection scheme for IC with power-down-mode operationen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/JSSC.2004.831501en_US
dc.identifier.journalIEEE JOURNAL OF SOLID-STATE CIRCUITSen_US
dc.citation.volume39en_US
dc.citation.issue8en_US
dc.citation.spage1378en_US
dc.citation.epage1382en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000222902600023-
dc.citation.woscount11-
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