標題: Wafer bonding by Ni-induced crystallization of amorphous silicon
作者: Chao, CP
Wu, YCS
Lee, TL
Wang, YH
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: wafer bonding;amorphous silicon;metal-induced crystallization of amorphous silicon;nickel and electric field
公開日期: 1-Sep-2003
摘要: Wafer bonding by Ni-induced crystallization of amorphous silicon was investigated. It was found that wafers can be bonded through the crystallization of amorphous silicon at temperatures below 550 degreesC. Moreover, when 250 V was applied across the stacked samples, the bonding temperatures could be decreased to as low as 350 degreesC.
URI: http://dx.doi.org/10.1143/JJAP.42.5527
http://hdl.handle.net/11536/27549
ISSN: 0021-4922
DOI: 10.1143/JJAP.42.5527
期刊: JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS
Volume: 42
Issue: 9A
起始頁: 5527
結束頁: 5530
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