標題: The microstructure and the thermal expansion characteristics of Cu/SiCp composites
作者: Shu, KM
Tu, GC
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: powder metallurgy;electroless plating;Cu/SiCp composites;microstructure;coefficient of thermal expansion;thermal hysteresis strain
公開日期: 25-五月-2003
摘要: Copper/silicon carbide composites (Cu/SiCp) were made by the powder metallurgy method. Electroless plating was employed to deposit a copper film on SiCp powder before mixing with Cu powder in order to improve the bonding status between Cu and SiC particles during sintering. Thermal expansion property of as-formed product was measured in the temperature range from 50 to 550 degreesC. The results showed that copper coating on silicon carbide particles could render uniform distribution of SiCp in the copper matrix. The composites exhibited positive thermal hysteresis behavior when cooled down from the peak temperature to room temperature, which can be explained in terms of the residual stresses and the interfacial bonding between copper and silicon carbide. The magnitude of this strain was a function of the SiCp volume fraction and the number of thermal cycles. The thermal expansion property of composites was measured and compared with those predicted from various theoretical models. (C) 2002 Published by Elsevier Science B.V.
URI: http://dx.doi.org/10.1016/S0921-5093(02)00788-8
http://hdl.handle.net/11536/27853
ISSN: 0921-5093
DOI: 10.1016/S0921-5093(02)00788-8
期刊: MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume: 349
Issue: 1-2
起始頁: 236
結束頁: 247
顯示於類別:期刊論文


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