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dc.contributor.authorChen, SBen_US
dc.contributor.authorHuang, CHen_US
dc.contributor.authorChin, Aen_US
dc.contributor.authorLin, Jen_US
dc.contributor.authorJou, JPen_US
dc.contributor.authorSu, KCen_US
dc.contributor.authorLiu, Jen_US
dc.date.accessioned2014-12-08T15:42:16Z-
dc.date.available2014-12-08T15:42:16Z-
dc.date.issued2002-07-01en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1482055en_US
dc.identifier.urihttp://hdl.handle.net/11536/28693-
dc.description.abstractWe have characterized the radio frequency (rf) noise in high-k Al2O3 and AlTiOx gate dielectrics, which have respective effective oxide thickness (EOT) of 17.2 and 12.5 Angstrom. The measured noise figure in gate dielectric is material dependent and sensitive to dielectric defect after stress. Although the high-k AlTiOx gate dielectric has lower EOT, it has a higher noise figure than others. From the simulation in our proposed equivalent circuit model, the dominant noise is thermal noise and the reason for increasing noise figure after stress is due to additional parallel resistance by trap-assisted tunneling. (C) 2002 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleRF noise characteristics of high-k AlTiOx and Al2O3 gate dielectricsen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1482055en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume149en_US
dc.citation.issue7en_US
dc.citation.spageF69en_US
dc.citation.epageF72en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000176251600044-
dc.citation.woscount0-
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