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dc.contributor.authorCho, CYSen_US
dc.contributor.authorChen, MJen_US
dc.contributor.authorLin, JHen_US
dc.contributor.authorChen, CFen_US
dc.date.accessioned2014-12-08T15:42:17Z-
dc.date.available2014-12-08T15:42:17Z-
dc.date.issued2002-07-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2002.1015226en_US
dc.identifier.urihttp://hdl.handle.net/11536/28708-
dc.description.abstractOverestimation of capacitance coupling coefficients in flash memory cells is encountered in the subthreshold slope method. By means of a two-parameters subthreshold current model I-D = I-o exp[q(V-GB - nV(SB))/nkT], a mathematical formulation of the subthreshold swing ratio in the subthreshold slope method is constructed to isolate the measurement errors caused by process variations from the errors traditionally caused by bulk capacitance coupling. To minimize the effect of process variations, a new method is developed based on the model. In this method, the control gate voltage shift due to weak body effect is measured in flash memory cells in subthreshold, while the corresponding slope factor n is adequately deduced from threshold voltage versus source-to-substrate bias measurement in dummy devices. The corrected capacitance coupling coefficients show large improvements compared to the design values, and the updated errors are found to be close to that caused solely by bulk capacitance coupling. The method is also fast since only a small source-to-substrate bias of 0.1 V is needed for implementation of weak body effect, and thereby it can be used as an in-line monitor of capacitance coupling coefficients.en_US
dc.language.isoen_USen_US
dc.subjectbody effecten_US
dc.subjectcapacitance couplingen_US
dc.subjectflash memoryen_US
dc.subjectmismatchen_US
dc.subjectMOSFETsen_US
dc.subjectsubthresholden_US
dc.titleA new process-variation-immunity method for extracting capacitance coupling coefficients in flash memory cellsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2002.1015226en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume23en_US
dc.citation.issue7en_US
dc.citation.spage422en_US
dc.citation.epage424en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000176491000016-
dc.citation.woscount2-
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