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dc.contributor.authorChen, SBen_US
dc.contributor.authorLai, CHen_US
dc.contributor.authorChin, Aen_US
dc.contributor.authorHsieh, JCen_US
dc.contributor.authorLiu, Jen_US
dc.date.accessioned2014-12-08T15:42:34Z-
dc.date.available2014-12-08T15:42:34Z-
dc.date.issued2002-04-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.992833en_US
dc.identifier.urihttp://hdl.handle.net/11536/28900-
dc.description.abstractWe have investigated the electrical characteristics of Al2O3 and AlTiOx MIM capacitors from IF (100 KHz) to RF (20 GHz) frequency range. Record high capacitance density of 0.5 and 1.0 muF/cm(2) are obtained for Al2O3 and AlTiOx MIM capacitors, respectively, and the fabrication process is compatible to existing VLSI backend integration. However, the AlTiOx MIM capacitor has very large capacitance reduction as increasing frequencies. In contrast, good device integrity has been obtained for Al2O3 MIM capacitor as evidenced from the small frequency dependence, low leakage current, good reliability, small temperature coefficient, and low loss tangent.en_US
dc.language.isoen_USen_US
dc.subjectcapacitoren_US
dc.subjectdielectric constanten_US
dc.subjectfrequency dependenceen_US
dc.subjecthigh ken_US
dc.subjectMIMen_US
dc.subjectRFen_US
dc.titleHigh-density MIM capacitors using Al2O3 and AlTiOx dielectricsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.992833en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume23en_US
dc.citation.issue4en_US
dc.citation.spage185en_US
dc.citation.epage187en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000174667800007-
dc.citation.woscount111-
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