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dc.contributor.authorLin, HCen_US
dc.contributor.authorYeh, KLen_US
dc.contributor.authorHuang, TYen_US
dc.contributor.authorHuang, RGen_US
dc.contributor.authorSze, SMen_US
dc.date.accessioned2014-12-08T15:42:48Z-
dc.date.available2014-12-08T15:42:48Z-
dc.date.issued2002-02-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/16.981216en_US
dc.identifier.urihttp://hdl.handle.net/11536/29022-
dc.description.abstractA novel Schottky-barrier metal-oxide-semiconductor thin-film transistor (SBTFT) was successfully demonstrated and characterized. The new SBTFT device features a fleld-induced-drain (FID) region, which is controlled by a metal field-plate lying on top of the passivation oxide. The FED region is sandwiched between the silicided drain and the active channel region. Carrier types and the conductivity of the transistor are controlled by the metal field-plate. The device is thus capable of ambipolar operation. Excellent ambipolar performance with on/off current ratios over 10(6) for both p- and n-channel operations was realized simultaneously on the same device fabricated with polysilicon active layer. Moreover, the off-state leakage current shows very weak dependence on the gate-to-drain voltage difference with the FID structure. Finally, the effects of FED length are explored.en_US
dc.language.isoen_USen_US
dc.subjectambipolaren_US
dc.subjectfield-induced drainen_US
dc.subjectSchottky barrieren_US
dc.subjectTFTen_US
dc.titleAmbipolar Schottky-barrier TFTsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/16.981216en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume49en_US
dc.citation.issue2en_US
dc.citation.spage264en_US
dc.citation.epage270en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000173613700008-
dc.citation.woscount17-
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